2025 Japan's Tariff Schedule ( Statistical Code for Import )(January 1, 2025 NEW)
Statistical code H.S.code | Description | Unit | Tariff rate General | Temporary | WTO | GSP | LDC | Compare |
---|---|---|---|---|---|---|---|---|
8541.60.090 | - Other | /NO | -- | |||||
8541.90.000 | Parts | /KG | Free | (Free) | Compare-8541.60.090 | |||
85.42.000 | Electronic integrated circuits | / | Compare-8541.90.000 | |||||
85.42.000 | Electronic integrated circuits : | / | Compare-85.42.000 | |||||
8542.31.000 | Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits | / | Free | (Free) | Compare-85.42.000 | |||
8542.31.010 | - Uncased | /NO | Compare-8542.31.000 | |||||
8542.31.010 | - Other | / | Compare-8542.31.010 | |||||
8542.31.020 | -- Hybrid integrated circuits | /NO | Compare-8542.31.010 | |||||
8542.31.020 | -- Other | / | Compare-8542.31.020 | |||||
8542.31.031 | --- MPU (Microprocessor unit) | /NO | Compare-8542.31.020 | |||||
8542.31.032 | --- MCU (Microcontroller unit) | /NO | Compare-8542.31.031 | |||||
8542.31.033 | --- DSP (Digital signal processor) | /NO | Compare-8542.31.032 | |||||
8542.31.039 | --- Other | /NO | Compare-8542.31.033 | |||||
8542.32.039 | Memories | / | Free | (Free) | Compare-8542.31.039 | |||
8542.32.039 | - Uncased | / | Compare-8542.32.039 | |||||
8542.32.011 | -- DRAM (Dynamic random access memory), metal oxide semiconductors (MOS technology) of the digital monolithic integrated circuits | /NO | Compare-8542.32.039 | |||||
8542.32.019 | -- Other | /NO | Compare-8542.32.011 | |||||
8542.32.019 | - Other | / | Compare-8542.32.019 | |||||
8542.32.019 | -- RAM (Random access memory) | / | Compare-8542.32.019 | |||||
8542.32.021 | --- DRAM (Dynamic random access memory), metal oxide semiconductors (MOS technology) of the digital monolithic integrated circuits | /NO | Compare-8542.32.019 |
**1The tariff rates in this column are for the tariff lines in the Schedule of Japan, Sub-Section 5, Section B, Annex I of the Agreement.